Qualcomm Technologies, Inc. has unveiled the groundbreaking Qualcomm® FastConnect™ 7900 Mobile Connectivity system, setting a new standard in high-performance, low-latency, and low-power connectivity. This innovative system, expected to launch commercially in the second half of 2024, integrates Wi-Fi 7, Bluetooth, and Ultra-Wideband technologies into a single chip, a first in the industry. With AI optimization, the FastConnect 7900 adapts dynamically to various environments and usage scenarios, delivering significant enhancements in power efficiency, network latency, and throughput.
One of the key highlights of the FastConnect 7900 is its integration of Ultra-Wideband technology, Wi-Fi Ranging, and Bluetooth Channel Sounding. This integration creates a powerful suite of proximity technologies, enabling secure and seamless device discovery, access, and control for applications such as digital keys, object finding, and indoor navigation.
Furthermore, the FastConnect 7900 boasts a new class of RF front-end modules and next-generation implementation of High Band Simultaneous technology, a pivotal innovation in the Wi-Fi 7 era. This technology forms the foundation of Qualcomm® Expanded Personal Area Network (XPAN) and Snapdragon Seamless experiences, enhancing multi-device connectivity and performance.
Javier del Prado, vice president and general manager for mobile connectivity at Qualcomm Technologies, Inc., expressed excitement about the FastConnect 7900, hailing it as a technological marvel. He emphasized its utilization of AI and integration of leading Wi-Fi 7 and Bluetooth capabilities alongside Ultra-Wideband on a single 6nm chip. Del Prado highlighted how the FastConnect 7900 ushers in a new era of connectivity, elevating AI, proximity, and multi-device experiences to new heights in our beloved devices.
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